Viettel begins construction of Vietnam's first chip plant with trial run targeted by late 2027

Viettel has started building Vietnam's first semiconductor fabrication plant in Hoa Lac Hi‑Tech Park, and trial production is expected by late 2027.

Viettel has started construction of Vietnam's first semiconductor fabrication plant on a 27-hectare site in Hoa Lac Hi‑Tech Park on the outskirts of Hanoi. The project is presented as part of Vietnam's effort to establish a domestic semiconductor manufacturing ecosystem. Viettel said construction and technology transfer will be completed by the end of next year, after which the facility will enter trial operation. Trial production is expected to begin by late 2027, with process refinement and equipment upgrades planned through 2030. Key facts: - The site covers 27 hectares in Hoa Lac Hi‑Tech Park near Hanoi. - Viettel said the plant will enable Vietnam to engage in all six stages of the semiconductor value chain, including wafer fabrication, which is not yet performed domestically. - The facility will focus on chip research, design, manufacturing and testing for sectors such as aerospace, telecommunications, medical equipment and automotive. - Viettel did not disclose the size of the investment for the project. - The article mentions global testing and packaging firms operating in Vietnam, including Intel, Samsung Electronics, Amkor Technology, Qualcomm and Marvell Technology. - A 2024 report cited in the article projects Vietnam's share of global assembly, testing and packaging capacity rising to 8%-9% by 2032 from 1% in 2022; the government plans to train 50,000 chip design engineers by 2030 and grow the semiconductor workforce to over 100,000 by 2040. Summary: The project would extend Vietnam's capabilities into wafer fabrication and other core stages of the chip value chain, expanding domestic production beyond testing and packaging. Trial operation is targeted by late 2027 after construction and technology transfer by the end of next year, with further process refinement and equipment upgrades planned through 2030. The scale of financial investment was not disclosed.